The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
Jun. 24, 2016
Infineon Technologies Ag, Neubiberg, DE;
Manfred Schneegans, Vaterstetten, DE;
Franziska Haering, Regensburg, DE;
Hans-Joachim Schulze, Taufkirchen, DE;
Bernhard Weidgans, Bernhardswald, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor device includes a semiconductor die that having a conductive structure. A metal structure is electrically connected to the conductive structure and contains a first metal. An auxiliary layer stack is sandwiched between the conductive structure and the metal structure and includes an adhesion layer that contains a second metal. The auxiliary layer stack further includes a metal diffusion barrier layer between the adhesion layer and the conductive structure. The adhesion layer contains the first metal and a second metal.