Cupertino, CA, United States of America

Atila Mertol

This inventor holds 15 USPTO granted patents, primarily in Thermal Management. Top assignees: Lsi Logic Corporation, Lsi Corporation. Active years: 1998-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Atila Mertol. Retrieved from https://idiyas.com/inventor/atila-mertol

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 93.3

Average Co-Inventor Count = 1.3

ph-index = 10

Forward Citations = 691(Granted Patents)


Location History:

  • Cupertino, CA (US) (1998 - 2010)
  • Milpitas, CA (US) (2015)

Company Filing History:


Years Active: 1998-2015

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Areas of Expertise:
Integrated Circuit Packages
Thermal Improvement
Flip Chip Wafers
Heat Transfer Mechanisms
Heat Sink Attachment
Redistribution Layer Traces
Current Crowding
Conformal Diamond Coating
Grid Array Device Package
Stiffener Ring
Electronic Devices
Thermally-Enhanced Packages
15 patents (USPTO):Explore Patents

Title: Atila Mertol: Innovator in Integrated Circuit Technology

Introduction

Atila Mertol is a prominent inventor based in Cupertino, CA, known for his significant contributions to the field of integrated circuit technology. With a total of 15 patents to his name, Mertol has made remarkable advancements that enhance the performance and efficiency of electronic devices.

Latest Patents

Mertol's latest patents include innovative designs aimed at improving thermal management in electronic devices. One of his notable inventions is a thermal improvement of integrated circuit packages, which features an active semiconductor device layer and at least one heat-transfer semiconductor layer. This design ensures that the heat-transfer semiconductor layer has a coefficient of thermal expansion that closely matches that of the active semiconductor device layer. Another significant patent is for a preferentially cooled electronic device, which outlines various apparatuses and methods for optimizing cooling in electronic apparatuses. This invention includes a package substrate with a semiconductor die that is electrically and thermally connected to the substrate through multiple connection nodes.

Career Highlights

Throughout his career, Atila Mertol has worked with leading companies in the technology sector, including LSI Logic Corporation and LSI Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of integrated circuit technology.

Collaborations

Mertol has collaborated with notable professionals in the field, including Zeki Z Celik and Senol Pekin. These collaborations have further enriched his work and have led to the development of groundbreaking technologies.

Conclusion

Atila Mertol's contributions to integrated circuit technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the design and efficiency of electronic devices, making a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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