The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
May. 21, 1997
Atila Mertol, Cupertino, CA (US);
Brent Bacher, Fremont, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An electronic semiconductor device package, the package having: a substrate having a top and bottom surface and having traces; a die attached to the top surface of the substrate; first level interconnects of the die to the traces of the substrate; encapsulant which covers the die and first level interconnects; and a lid attached to the encapsulant, wherein the lid comprises at least one lid support which extends from the lid to the substrate. A fixture for attaching a lid to an electronic semiconductor device package, the package having: a substrate having a top surface and a bottom surface and having traces, a die attached to the top surface of the substrate, first level interconnects of the die to the traces of the substrate, and the fixture having: an interior opening for receiving the lid and package, wherein the interior opening comprises first and second walls, wherein the first wall of the interior opening corresponds to an outside dimension of the substrate and wherein the second wall corresponds to an outside dimension of the lid. A method of attaching a lid to an electronic semiconductor device package, the package having: a substrate having a top surface and a bottom surface and having traces, a die attached to the top surface of the substrate, first level interconnects of the die to the traces of the substrate, and the method having: inserting a lid into a fixture, wherein the fixture comprises an interior opening for receiving the lid and package wherein the interior opening has a first wall corresponding to a dimension of the substrate and a second wall corresponding to a dimension of the lid; applying adhesive between the lid and package; and inserting a package into the fixture.