The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 1999
Filed:
Apr. 28, 1997
Atila Mertol, Cupertino, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An encapsulated semiconductor package assembly including a substrate, a die operatively disposed on the substrate, a lid for support by the substrate over the die, a heat sink operatively on the lid and a releasable clip which clips the heat sink releasably to the lid. With the encapsulant over the die but not yet solidified, the lid is pressed down into the encapsulant and onto the substrate. Thereby when the encapsulant is cured the lid is held in place on the substrate. The clip clips onto a lip or a slot of the lid to releasably hold a heat sink on the lid for dissipating heat from the die. The lip can be formed by an overhanging portion of the lid, and the slot can be formed in a side wall of the lid.