The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
Apr. 25, 1997
Atila Mertol, Cupertino, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one slot. A system for attaching a heat sink to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package which is attachable to the electronic package; a clip which secures the heat sink to the stiffener; and at least one slot in the stiffener which receives the clip. A method of detachably attaching a heat sink to an electronic semiconductor device package, the method comprising: attaching a stiffener to the package, wherein the stiffener comprises at least one slot; positioning a heat sink adjacent the stiffener; and engaging a clip with the slot and the heat sink, wherein the heat sink is secured to the stiffener by the clip.