The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1999
Filed:
Jun. 03, 1997
Atila Mertol, Cupertino, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
According to one aspect of the invention, a semiconductor package is provided including a package substrate having an upper surface and a lower surface, wherein electrical contacts on the lower surface of the substrate are coupled to corresponding electrical contacts on a printed circuit board by a plurality of solder balls; a semiconductor die having a non-active surface and an active surface, wherein the active surface is electrically coupled to the upper surface of the package substrate by a plurality of solder bumps; and an integrated heat spreader and ring stiffener coupled with the non-active surface of the semiconductor die by a phase change material which is retained by a miniature dam ring while in a liquid state, wherein heat generated by the die is transferred to the heat spreader, and wherein the heat spreader has a protrusion formed thereon which matches the outermost size of the die.