The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2000
Filed:
Jan. 20, 1998
Atila Mertol, Cupertino, CA (US);
Zeki Z Celik, Sunnyvale, CA (US);
Farshad Ghahghahi, Los Gatos, CA (US);
Zafer S Kutlu, Sunnyvale, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A thermally-enhanced flip chip integrated circuit (IC) package has a package substrate to which an IC die is bonded. A thermally-conductive heatspreader, having planar dimensions larger than the IC die, is thermally bonded at or near its center to an upper surface of the IC die. A plurality of cooling extensions are formed that protrude from a lower surface (the surface closest to the package substrate) of the heatspreader so as to create passageways through which cooling air may flow. In one embodiment, the cooling extensions are parallel fins that protrude transversely from the lower surface of the heatspreader, thereby forming U-shaped channels. In another embodiment, the cooling extensions are an array of fin pins that protrude transversely from the lower surface of the heatspreader.