Zeki Z Celik

Title: Zeki Z Celik: Innovator in Integrated Circuit Technology

Introduction

Zeki Z Celik is a prominent inventor based in Milpitas, CA, known for his contributions to integrated circuit technology. With a total of 4 patents, he has made significant advancements in the field, particularly in thermal management and grounding techniques for semiconductor devices.

Latest Patents

One of his latest patents is focused on the thermal improvement of integrated circuit packages. This innovation involves an integrated circuit package that includes an active semiconductor device layer and at least one heat-transfer semiconductor layer. The heat-transfer semiconductor layer is designed to have a coefficient of thermal expansion that closely matches that of the active semiconductor device layer. Another notable patent details a process for grounding a heat spreader or stiffener to a flip chip package using solder and film adhesive. This method includes attaching an adhesive film to a substrate and securing a stiffener to the adhesive film, ensuring effective electrical grounding through strategically placed holes.

Career Highlights

Throughout his career, Zeki has worked with notable companies such as LSI Logic Corporation and LSI Corporation. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the semiconductor industry.

Collaborations

Zeki has collaborated with several professionals in his field, including Atila Mertol and Zafer S Kutlu. These partnerships have fostered innovation and the sharing of ideas, further enhancing his contributions to technology.

Conclusion

Zeki Z Celik's work in integrated circuit technology exemplifies the impact of innovative thinking in the semiconductor industry. His patents reflect a commitment to improving thermal management and grounding techniques, which are crucial for the advancement of electronic devices.