Lsi Logic Corporation

Lsi Corporation

Zeki Z Celik

Zafer S Kutlu

Atila Mertol

Farshad Ghahghahi

Allen S Lim

Vishal Shah

An integrated circuit package comprising an active semiconductor device layer and at least one heat-transfer semiconductor layer on the active semiconductor device layer. The heat-transfer semiconductor layer has a coefficient of thermal expansion that substantially matches a coefficient of thermal expansion of the active semiconductor device layer.

Thermal improvement of integrated circuit packages

A method of grounding a heat spreader/stiffener to a flip chip package comprising the steps of attaching an adhesive film to a substrate and attaching a stiffener to the adhesive film. The adhesive film may have a number of first holes corresponding with a number of grounding pads on the substrate. The grounding pads may be configured to provide electrical grounding. The stiffener may have a number of second holes corresponding with the number of first holes of the adhesive film and number the grounding pads of the substrate. The grounding pads are generally exposed through the first and the second holes.

Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive

A thermally-enhanced flip chip integrated circuit (IC) package has a package substrate to which an IC die is bonded. A thermally-conductive heatspreader, having planar dimensions larger than the IC die, is thermally bonded at or near its center to an upper surface of the IC die. A plurality of cooling extensions are formed that protrude from a lower surface (the surface closest to the package substrate) of the heatspreader so as to create passageways through which cooling air may flow. In one embodiment, the cooling extensions are parallel fins that protrude transversely from the lower surface of the heatspreader, thereby forming U-shaped channels. In another embodiment, the cooling extensions are an array of fin pins that protrude transversely from the lower surface of the heatspreader.

Thermally-enhanced flip chip IC package with extruded heatspreader

An apparatus is described which determines the velocity of a fluid flow stream by measuring the frequency of vortex shedding from an obstruction in the fluid flow stream. A constant known as the Strouhal number is used to relate the measured vortex shedding frequency to the fluid flow velocity. The Strouhal number is a function of the Reynolds number for the obstruction, which is also a function of fluid flow velocity. Hence, an iterative technique is provided, first using an estimated Strouhal number to estimate the fluid flow velocity, using the estimated fluid flow velocity to estimate the Reynolds number, then using the Reynolds number to get a better estimate of the Strouhal number. The apparatus repeats this cycle until the estimate of the fluid flow velocity converges.

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Milpitas, CA, United States of America

Zeki Z Celik