The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2000
Filed:
May. 05, 1997
Atila Mertol, Cupertino, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one hole. A system for attaching a heat dissipater to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package comprising at least one hole, wherein the stiffener is attachable to the electronic package; a heat dissipater comprising at least one pin, wherein the pin is engagable with the hole. A method of attaching a heat sink to an electronic semiconductor device package, the method comprising: attaching a stiffener to the package, wherein the stiffener comprises at least one hole; positioning a heat dissipater adjacent the stiffener, wherein the heat dissipater comprises at least one pin; and engaging the pin with the hole, wherein the heat dissipater is secured to the stiffener by the pin and hole. An electronic semiconductor device package, the package comprising: a substrate having a top and bottom surface and having traces; a die attached to the top surface of the substrate; first level interconnects of the die to the traces of the substrate; a stiffener having a top, bottom and opening, attached at the bottom to the top of the substrate, wherein the die is inside the opening, and wherein the stiffener comprises at least one hole in the top; encapsulant within the opening of the stiffener which covers the die and first level interconnects; and a heat dissipater adjacent the stiffener and encapsulant, wherein the heat dissipater comprises at least one pin that protrudes from the heat dissipater and engages the hole of the stiffener, whereby the pin and hole secure the heat dissipater to the stiffener.