IDiyas

For the Inventor, By the Inventor

Batam Island, Indonesia

Anang Subagio

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.3

ph-index = 10

Forward Citations = 334(Granted Patents)


Company Filing History:

goldMedal12 out of 18 
 
Unisem (mauritius) Holdings Limited
 patents
silverMedal1 out of 10 
 
Advanced Interconnect Technologies Limited
 patents
bronzeMedal1 out of 1 
 
Unisem (mauritus) Holdings Limited
 patent

Years Active: 2007-2012

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14 patents (USPTO):
1. 8304864 - Lead frame routed chip pads for semiconductor packages (2012-11-06),
2. 8236612 - Partially patterned lead frames and methods of making and using the same in semiconductor packaging (2012-08-07),
3. 8084300 - RF shielding for a singulated laminate semiconductor device package (2011-12-27),
4. 8022512 - No lead package with heat spreader (2011-09-20),
5. 7943431 - Leadless semiconductor package and method of manufacture (2011-05-17),
6. 7820480 - Lead frame routed chip pads for semiconductor packages (2010-10-26),
7. 7816186 - Method for making QFN package with power and ground rings (2010-10-19),
8. 7799611 - Partially patterned lead frames and methods of making and using the same in semiconductor packaging (2010-09-21),
9. 7795710 - Lead frame routed chip pads for semiconductor packages (2010-09-14),
10. 7790500 - Partially patterned lead frames and methods of making and using the same in semiconductor packaging (2010-09-07),
11. 7741158 - Method of making thermally enhanced substrate-base package (2010-06-22),
12. 7700414 - Method of making flip-chip package with underfill (2010-04-20),
13. 7563648 - Semiconductor device package and method for manufacturing same (2009-07-21),
14. 7262491 - Die pad for semiconductor packages and methods of making and using same (2007-08-28),

Title: Anang Subagio: Pioneering Innovations in Batam Island, ID

Introduction:

Anang Subagio stands as a beacon of innovation in Batam Island, ID, inspiring others with his inventive spirit and commitment to creating a better future through his groundbreaking inventions. With an impressive portfolio of 14 patents to his name, Anang Subagio has made significant contributions to the field of semiconductor packaging.

Latest Patents:

Anang Subagio's latest patents showcase his expertise in the semiconductor industry. One of his patents involves lead frame routed chip pads for semiconductor packages, a revolutionary process that enables the manufacture of chip scale packages and very thin packages. Another patent focuses on partially patterned lead frames, improving automation in the manufacturing line and enhancing the quality and reliability of the packages produced.

Career Highlights:

Throughout his career, Anang Subagio has worked with renowned companies such as Unisem Holdings Limited and Advanced Interconnect Technologies Limited. His expertise and innovative approach have helped these companies stay at the forefront of technological advancements in the semiconductor industry.

Collaborations:

Anang Subagio has collaborated with talented individuals such as Romarico Santos San Antonio and Shafidul Islam, who have worked alongside him to bring his groundbreaking inventions to life. Their combined efforts have led to the successful implementation of innovative solutions in semiconductor packaging.

Conclusion:

In conclusion, Anang Subagio's pioneering work in semiconductor packaging has cemented his reputation as a visionary inventor in Batam Island, ID. His commitment to pushing the boundaries of innovation serves as an inspiration to aspiring inventors and underscores the importance of creativity and perseverance in driving technological progress.

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