The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Mar. 06, 2007
Romarico S. San Antonio, Batam Island, ID;
Anang Subagio, Batam Island, ID;
Romarico S. San Antonio, Batam Island, ID;
Anang Subagio, Batam Island, ID;
Unisem (Mauritius) Holdings Limited, Port Louis, MU;
Abstract
A method to manufacture a package that encases at least one integrated circuit device and the package so manufactured. The method includes the steps of (1) providing a leadframe having a die pad, leads, at least one ring circumscribing the die pad and disposed between the die pad and the leads, a plurality of tie bars projecting outwardly from the at least one ring, and at least one connecting bar electrically interconnecting and mechanically supporting the die pad to the ring; (2) affixing the at least one integrated circuit device to a first side of the die pad and electrically interconnecting the at least one integrated circuit device to the leads and to the at least one ring; (3) encapsulating the at least one integrated circuit device, the first side of the die pad and a first side of the ring in a molding resin while retaining an opposing second side of the ring external to said molding resin; and (4) severing the at least one connecting bar to electrically isolate the die pad from the ring.