The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
May. 30, 2007
Timothy Leung, Singapore, SG;
Mary Jean Bajacan Ramos, Alessandrea, SG;
Gan Kian Yeow, Singapore, SG;
Kyaw Ko Lwin, Singapore, SG;
Romarico Santos San Antonio, Batam Island, ID;
Anang Subagio, Batam Island, ID;
Timothy Leung, Singapore, SG;
Mary Jean Bajacan Ramos, Alessandrea, SG;
Gan Kian Yeow, Singapore, SG;
Kyaw Ko Lwin, Singapore, SG;
Romarico Santos San Antonio, Batam Island, ID;
Anang Subagio, Batam Island, ID;
Unisem (Mauritius) Holdings Limited, Port Louis, MU;
Abstract
An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a mid portion extending through the aperture, a first portion adjacent the first side of the substrate with a cross sectional area larger than the cross sectional area of the aperture and an opposing second portion adjacent the second side of the substrate. One or more semiconductor devices are bonded to the first portion of the heat slug and electrically interconnected to the electrically conductive vias. A heat spreader having a first side and an opposing second side is spaced from the semiconductor devices and generally parallel with the heat slug, whereby the semiconductor devices are disposed between the heat spreader and the heat slug. A molding resin encapsulates the semiconductor devices and at least the first side of the substrate, the first portion of the heat slug and the first side of the heat spreader.