The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Jan. 19, 2011
Romarico S. San Antonio, Bulacan, PH;
Michael H. Mckerreghan, Farmers Branch, TX (US);
Anang Subagio, Batam Island, ID;
Allan C. Toriaga, Pangasinan, PH;
Romarico S. San Antonio, Bulacan, PH;
Michael H. McKerreghan, Farmers Branch, TX (US);
Anang Subagio, Batam Island, ID;
Allan C. Toriaga, Pangasinan, PH;
Unisem (Mauritius) Holdings Limited, Port Louis, MU;
Abstract
A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation.