The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2010
Filed:
Feb. 22, 2007
Romarico Santos San Antonio, Batam Island, ID;
Anang Subagio, Batam Island, ID;
Glenn Macaraeg, Graz, AT;
Mary Jean Bajacan Ramos, Alessandrea, SG;
Romarico Santos San Antonio, Batam Island, ID;
Anang Subagio, Batam Island, ID;
Glenn Macaraeg, Graz, AT;
Mary Jean Bajacan Ramos, Alessandrea, SG;
Unisem (Mauritius) Holdings Limited, Port Louis, MU;
Abstract
A method for the manufacture of a package to encapsulate at least one integrated circuit device includes the steps of: (1) providing a dielectric substrate having a first plurality of bond pads formed on a first side thereof and at least one aperture; (2) electrically interconnecting the integrated circuit device to the plurality of bond pads forming a substrate/integrated circuit device assembly; (3) gravitationally aligning the substrate/integrated circuit assembly such that the integrated circuit device is lower than said substrate; (4) introducing a volume of a low viscosity dielectric into the at least one aperture, wherein the volume is effective to coat a surface of the integrated circuit device and substantially fill the at least one aperture; and (5) encapsulating the integrated circuit device and the first side of said substrate with a dielectric polymer.