This inventor holds 1 USPTO granted patent. Top assignee: Unisem (Mauritius) Holdings Limited. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Glenn Macaraeg: Innovator in Flip-Chip Packaging Technology
Introduction
Glenn Macaraeg is a notable inventor based in Graz, Austria. He has made significant contributions to the field of integrated circuit packaging, particularly through his innovative patent related to flip-chip technology. His work has implications for the efficiency and reliability of electronic devices.
Latest Patents
Glenn Macaraeg holds a patent for a "Method of making flip-chip package with underfill." This patent outlines a comprehensive method for manufacturing a package that encapsulates at least one integrated circuit device. The process includes several key steps: providing a dielectric substrate with bond pads, electrically interconnecting the integrated circuit device, gravitationally aligning the assembly, introducing a low viscosity dielectric, and finally encapsulating the device with a dielectric polymer. This method enhances the performance and durability of electronic components.
Career Highlights
Glenn Macaraeg is currently employed at Unisem (Mauritius) Holdings Limited, where he continues to develop innovative solutions in the field of semiconductor packaging. His expertise in flip-chip technology has positioned him as a valuable asset in the industry.
Collaborations
Glenn has collaborated with several talented individuals, including Romarico Santos San Antonio and Anang Subagio. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Glenn Macaraeg's contributions to flip-chip packaging technology exemplify his commitment to innovation in the electronics industry. His patent and ongoing work at Unisem highlight the importance of advancements in semiconductor manufacturing.