The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Nov. 24, 2010
Romarico S. San Antonio, San Miguel, PH;
Michael H. Mckerreghan, Farmers Branch, TX (US);
Anang Subagio, Batam Island, ID;
Allan C. Toriaga, Asingan, PH;
Lenny Christina Gultom, Bekasi Barat, ID;
Romarico S. San Antonio, San Miguel, PH;
Michael H. McKerreghan, Farmers Branch, TX (US);
Anang Subagio, Batam Island, ID;
Allan C. Toriaga, Asingan, PH;
Lenny Christina Gultom, Bekasi Barat, ID;
Unisem (Mauritius) Holdings Limited, Port Louis, MU;
Abstract
A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is disposed on a tape; the molding compound and the substrate are cut through, forming package units separated by the saw cut width and exposing a portion of a conducting pad. In an embodiment, the tape is stretched to widen the gap between package units. A conductive shield is applied to cover each package unit and to make electrical contact with the exposed conducting pad portion, thereby connecting to a ground trace beneath the device and providing RF shielding for the device. A single-unit molding process may be used, in which the conducting pad is exposed during and after molding.