The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Nov. 21, 2007
Shafidul Islam, Plano, TX (US);
Romarico Santos San Antonio, Batam Island, ID;
Anang Subagio, Batam Island, ID;
Shafidul Islam, Plano, TX (US);
Romarico Santos San Antonio, Batam Island, ID;
Anang Subagio, Batam Island, ID;
Unisem (Mauritius) Holdings Limited, Port Louis, MU;
Abstract
A redistributed lead frame for use in a molded plastic semiconductor package () is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated by channels, (b) disposing a first molding compound () within these channels, (c) patterning a second side of the electrically conductive substrate to form an array of chip attach sites () and routing circuits () electrically interconnecting the array of lands and the array of chip attach sites (), (d) directly electrically interconnecting input/output pads on the at least one semiconductor device () to chip attach site members () of the array of chip attach sites (), and (e) encapsulating the at least one semiconductor device (), the array of chip attach sites () and the routing circuits () with a second molding compound (). This process is particularly suited for the manufacture of chip scale packages and very thin packages.