Altti Torkkeli

Title: Altti Torkkeli: Innovator in Wafer Bonding Technologies

Introduction

Altti Torkkeli is a prominent inventor based in Tuusula, Finland. He has made significant contributions to the field of microelectromechanical systems (MEMS) and wafer bonding technologies. With a total of 15 patents to his name, Torkkeli's work has advanced the capabilities of MEMS structures and bonding methods.

Latest Patents

Among his latest patents is a method for bonding wafers, which introduces an improved wafer bonding technique that utilizes at least one prebonding element. This element is designed to deflect in the out-of-plane direction, enhancing the bonding process. Another notable patent involves a MEMS structure that includes a cap with a via. This microelectromechanical structure features a first wafer structure bonded to a second wafer structure. The first wafer structure is composed of silicon wafer material and includes a through via, along with an isolation structure that separates the via from the build part. The design allows for a significant increase in gap height within MEMS structures, showcasing Torkkeli's innovative approach to engineering.

Career Highlights

Throughout his career, Altti Torkkeli has worked with reputable companies such as Murata Manufacturing Co., Ltd. and Murata Electronics Oy. His experience in these organizations has contributed to his expertise in wafer bonding and MEMS technologies.

Collaborations

Torkkeli has collaborated with notable professionals in his field, including Anssi Blomqvist and Matti Liukku. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Altti Torkkeli's contributions to wafer bonding and MEMS technology have established him as a key figure in the field of innovation. His patents reflect a commitment to advancing technology and improving engineering practices.