The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Apr. 11, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto, JP;

Inventors:

Altti Torkkeli, Tuusula, FI;

Tapani Laaksonen, Espoo, FI;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); G02B 7/182 (2006.01); G02B 26/10 (2006.01); B81C 1/00 (2006.01); G02B 1/11 (2015.01); G02B 5/08 (2006.01); G02B 26/08 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0054 (2013.01); B81B 3/007 (2013.01); B81B 7/0067 (2013.01); B81C 1/0019 (2013.01); G02B 1/11 (2013.01); G02B 5/0825 (2013.01); G02B 7/1821 (2013.01); G02B 26/0833 (2013.01); G02B 26/0841 (2013.01); G02B 26/0858 (2013.01); G02B 26/105 (2013.01); B81B 2201/042 (2013.01); B81B 2203/0109 (2013.01); B81B 2203/0163 (2013.01); B81B 2207/07 (2013.01); B81B 2207/095 (2013.01); B81C 2203/0109 (2013.01); G02B 26/0816 (2013.01);
Abstract

An optical device formed of a mirror wafer, a cap wafer, and a glass wafer. The mirror wafer includes a first layer of electrically conductive material, a second layer of electrically conductive material, and a third layer of electrically insulating material between the first layer and the second layer. A mirror element is formed of the second layer of the mirror wafer, and has a reflective surface in the bottom of a cavity opened into at least the first layer. A good optical quality planar glass wafer can be used to enclose the mirror element when the mirror wafer, cap wafer, and glass wafer are bonded to each other.


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