The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Jun. 13, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Altti Torkkeli, Tuusula, FI;

Jussi Oksanen, Nummela, FI;

Aarni Härkönen, Helsinki, FI;

Juha Lahdenperä, Espoo, FI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 3/00 (2006.01); B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
B81C 3/001 (2013.01); B81B 7/02 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/0361 (2013.01); B81B 2203/04 (2013.01); B81B 2207/094 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0147 (2013.01); B81C 2201/0156 (2013.01); B81C 2203/031 (2013.01);
Abstract

A microelectromechanical element is provided with patterned regions of wafer material and glass material. The regions of glass material include at least a first glass region and a second glass region formed of a first glass material and a second glass material, respectively. The first glass material enables anodic bonding with the wafer material. An alkali metal content of the second glass material is less than an alkali metal content of the first glass material.


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