Osaka, Japan

Akio Furusawa

This inventor holds 27 USPTO granted patents and 13 published patent applications and 7 EPO patents, primarily in Semiconductor Bonding. Top assignees: Panasonic Intellectual Property Management Co., Ltd., Panasonic Corporation, Matsushita Electric Industrial Co., Ltd.. Active years: 1999-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akio Furusawa. Retrieved from https://idiyas.com/inventor/akio-furusawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 27 

% Patents Active = 63.0

 

Average Co-Inventor Count = 3.8

ph-index = 4

Forward Citations = 48(Granted Patents)


Location History:

  • Katano, JP (1999 - 2007)
  • Osaka, JP (2011 - 2022)

Company Filing History:


Years Active: 1999-2022

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Areas of Expertise:
Nanoparticle Mounting
Bonded Structure
Solder Alloy
Electronic Component
Mounting Structure
Jointing Material
Fabrication Method
Semiconductor Device
BGA Ball
Lead-Free Solder
Solder Paste
Manufacturing Method
27 patents (USPTO):Explore Patents

Title: Akio Furusawa: Pioneering Innovations in Bonding Materials

Introduction

Akio Furusawa, based in Osaka, Japan, is a distinguished inventor with a remarkable portfolio of 27 patents. His work primarily focuses on advancements in bonding materials and mounting structures, significantly contributing to the fields of semiconductor technology and materials science.

Latest Patents

Furusawa's recent innovations include two notable patents. The first, titled "Bonded Structure and Bonding Material," introduces a unique bonding material designed to form connections between two objects. This innovative material comprises first metal particles with diameters ranging from 20 nm to 1 µm and second metal particles consisting of alloys of Tin (Sn) along with Bismuth (Bi), Indium (In), and Zinc (Zn), all having melting points not exceeding 200°C.

The second patent, "Mounting Structure and Nanoparticle Mounting Material," describes a sophisticated mounting structure that includes a semiconductor element and a sintered body. This sintered body bonds the semiconductor to a metal member, incorporating a first metal and a second metal that dissolves in the first. The second metal is characterized by a higher diffusion coefficient, ensuring efficient bonding properties.

Career Highlights

Furusawa has held significant positions at prominent companies, including Panasonic Intellectual Property Management Co., Ltd. and Panasonic Corporation. His experience in these organizations has enabled him to contribute his inventive prowess to cutting-edge technologies.

Collaborations

Throughout his career, Akio Furusawa has collaborated with esteemed colleagues, including Kiyohiro Hine and Hidetoshi Kitaura. These partnerships have fostered a creative environment conducive to innovation and have led to the successful development of several pioneering technologies.

Conclusion

Akio Furusawa's contributions to the fields of bonding materials and semiconductor technology underline his status as a significant inventor. With a total of 27 patents, his innovative spirit continues to drive advancements that enhance the efficiency and effectiveness of modern technologies. His work stands as a testament to the impact of dedicated inventors in shaping the future of industrial and technological landscapes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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