The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Oct. 30, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Kiyohiro Hine, Osaka, JP;

Akio Furusawa, Osaka, JP;

Hidetoshi Kitaura, Osaka, JP;

Kazuki Sakai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H01L 23/488 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H01L 21/52 (2013.01); H01L 23/00 (2013.01); H01L 23/488 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29209 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29213 (2013.01); H01L 2224/29217 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29257 (2013.01); H01L 2924/014 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A mount structure includes two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members. The bonding material layer contains a first intermetallic compound and a stress relaxation material. The first intermetallic compound has a spherical, a columnar, or an oval spherical shape, and the same crystalline structure as the first interface layer and the second interface layer, and partly closes the space between the first interface layer and the second interface layer. The stress relaxation material contains tin as a main component, and fills around the first intermetallic compound.


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