The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Apr. 13, 2020
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Assignee:
PANASONIC HOLDINGS CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); H01L 24/83 (2013.01); H01L 2224/2922 (2013.01); H01L 2224/2926 (2013.01); H01L 2224/29209 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29213 (2013.01); H01L 2224/29218 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01083 (2013.01);
Abstract
There is provided a bonding material which forms a bonding portion between two objects, which material contains (1) first metal particles comprising a first metal and having a median particle diameter in the range of 20 nm to 1 μm, and (2) second metal particles comprising, as a second metal, at least one alloy of Sn and at least one selected from Bi, In and Zn and having a melting point of not higher than 200° C.