The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Sep. 20, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hidetoshi Kitaura, Osaka, JP;

Akio Furusawa, Osaka, JP;

Kiyohiro Hine, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 1/00 (2006.01); B23K 31/02 (2006.01); H01L 35/08 (2006.01); C22C 13/02 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); B23K 31/02 (2013.01); C22C 13/02 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 35/08 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 24/83 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32258 (2013.01); H01L 2224/32503 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/83097 (2013.01); H01L 2224/83192 (2013.01);
Abstract

A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.


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