The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Dec. 21, 2011
Applicants:

Kiyohiro Hine, Osaka, JP;

Akio Furusawa, Osaka, JP;

Masato Mori, Hyogo, JP;

Inventors:

Kiyohiro Hine, Osaka, JP;

Akio Furusawa, Osaka, JP;

Masato Mori, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/34 (2006.01); B23K 1/19 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 13/04 (2006.01); B23K 35/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B23K 1/19 (2013.01); B23K 35/0261 (2013.01); B23K 35/24 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H05K 3/3442 (2013.01); H05K 13/0465 (2013.01); H05K 3/3452 (2013.01); H05K 3/3463 (2013.01); H05K 3/3484 (2013.01); H05K 2201/099 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/1476 (2013.01);
Abstract

The present invention has an aspect to provide a mounted structure of which heat-resistant fatigue characteristic is improved. A mounted structure is provided with a substrate having a substrate electrode, an electronic component having a component electrode, and a bonding part bonding the substrate electrode and the component electrode, wherein the bonding part is constituted by a solder reinforcing part and a solder bonding part, the solder reinforcing part is a side vicinity part of the bonding part, and is constituted by In of 3 wt % or more and 8 wt % or less and Sn of 88 wt % or more, and the solder bonding part is constituted by a Sn—Bi system solder material and In of 0 wt % or more and less than 3 wt %.


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