The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Sep. 15, 2016
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01); H05K 1/181 (2013.01); H05K 3/3457 (2013.01); H05K 3/3463 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11);
Abstract
A solder alloy is substantially Ag-free and has desirable neat-resistance fatigue characteristics in a high-temperature environment as high as 150° C., even when used for soldering of electronic components having no leads. The solder alloy contains Sb, In, Cu, and Bi, and Sn accounting for the remainder, and satisfies the following formulae:0.5≤[Sb]≤1.250.66[Sb]+4.16≤[In]≤6.00.5≤[Cu]≤1.20.1≤[Bi]≤0.5,wherein [Sb], [In], [Cu], and [Bi] represent the contents of Sb, In, Cu, and Bi, respectively, in mass %.