The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Apr. 28, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Shinnosuke Akiyama, Osaka, JP;

Kiyohiro Hine, Osaka, JP;

Hidetoshi Kitaura, Osaka, JP;

Akio Furusawa, Osaka, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01); H05K 1/182 (2013.01); H05K 2201/10022 (2013.01);
Abstract

There is provided a solder alloy in which 0.5 mass % or more and 1.25 mass % or less of Sb, In satisfying the following formula (I) or (II) when [Sb] is set as a Sb content percentage (mass %) and [In] is set as an In content percentage (mass %): in a case of 0.5≤[Sb]≤1.0, 5.5≤[In]≤5.50+1.06[Sb] . . . (I), in a case of 1.0<[Sb]≤1.25, 5.5≤[In]≤6.35+0.212[Sb] . . . (II) (in the formula, [Sb] indicates a Sb content percentage (mass %) and [In] indicates an In content percentage (mass %)), 0.5 mass % or more and 1.2 mass % or less of Cu, 0.1 mass % or more and 3.0 mass % or less of Bi, 1.0 mass % or more and 4.0 mass % or less of Ag, and 0 mass % or more and 0.025 mass % or less of Co are contained, and has the remainder consisting essentially of Sn.


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