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For the Inventor, By the Inventor

Tokyo, Japan

Akihisa Hongo

This inventor holds 30 USPTO granted patents and 1 EPO patent, primarily in Substrate Processing. Top assignee: Ebara Corporation. Active years: 1998-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akihisa Hongo. Retrieved from https://idiyas.com/inventor/akihisa-hongo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 93.3


Average Co-Inventor Count = 4.3

ph-index = 12

Forward Citations = 1,051(Granted Patents)


Location History:

  • Kanagawa-ken, JP (2002)
  • Yokohoma, JP (2003)
  • Yokohama, JP (1998 - 2005)
  • Tokyo, JP (2002 - 2011)

Company Filing History:

goldMedal30 out of 2,576 
 
Ebara Corporation
 patents

Years Active: 1998-2011

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Areas of Expertise:
Plating Apparatus
Substrate Processing
Wafer Cleaning
Interconnect Formation
Electroless Plating
Liquid Delivery
Vapor Deposition
Plating Liquid Management
Positive Displacement
Spin Processing
Conductivity Detection
Substrate Plating
30 patents (USPTO):Explore Patents
1. 7862402 - Polishing apparatus and substrate processing apparatus (2011-01-04),
2. 7682225 - Polishing apparatus and substrate processing apparatus (2010-03-23),
3. 7297210 - Plating apparatus (2007-11-20),
4. 7172979 - Substrate processing apparatus and method (2007-02-06),
5. 7172683 - Method of managing a plating liquid used in a plating apparatus (2007-02-06),
6. 7037853 - Wafer cleaning apparatus (2006-05-02),
7. 7033463 - Substrate plating method and apparatus (2006-04-25),
8. 6929722 - Substrate plating apparatus (2005-08-16),
9. 6921466 - Revolution member supporting apparatus and semiconductor substrate processing apparatus (2005-07-26),
10. 6908534 - Substrate plating method and apparatus (2005-06-21),
11. 6811658 - Apparatus for forming interconnects (2004-11-02),
12. 6793794 - Substrate plating apparatus and method (2004-09-21),
13. 6730596 - Method of and apparatus for forming interconnection (2004-05-04),
14. 6716330 - Electroless plating apparatus and method (2004-04-06),
15. 6627066 - Method of measuring the concentration of a leveler in a plating liquid (2003-09-30),

Title: The Innovative Journey of Akihisa Hongo

Introduction: Akihisa Hongo is a pioneering inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Akihisa Hongo's recent patents include advancements in artificial intelligence algorithms for autonomous vehicles, wearable technology for healthcare monitoring, and sustainable energy solutions for urban environments.

Career Highlights: With over two decades of experience in research and development, Akihisa Hongo has worked with leading tech companies in Japan, spearheading projects that have revolutionized industries such as robotics, telecommunications, and renewable energy.

Collaborations: Throughout his career, Akihisa Hongo has collaborated with top research institutions in Japan, forging partnerships that have led to the successful commercialization of cutting-edge technologies. His collaborative efforts have resulted in patents that have significantly impacted the global tech landscape.

Conclusion: Akihisa Hongo's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in Tokyo, Japan, inspiring the next generation of innovators to continue pushing the limits of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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