The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2005
Filed:
Dec. 18, 2001
Akihisa Hongo, Tokyo, JP;
Mizuki Nagai, Tokyo, JP;
Kanji Ohno, Kanagawa, JP;
Ryoichi Kimizuka, Tokyo, JP;
Megumi Maruyama, Kanagawa, JP;
Akihisa Hongo, Tokyo, JP;
Mizuki Nagai, Tokyo, JP;
Kanji Ohno, Kanagawa, JP;
Ryoichi Kimizuka, Tokyo, JP;
Megumi Maruyama, Kanagawa, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W having fine pits () to fill the fine pits with a metal () and includes performing a first plating process () by immersing the wafer in a first plating solution having a composition superior in throwing power; and performing a second plating process () by immersing the substrate in a second plating solution having a composition superior in leveling ability.