Location History:
- Kanagawa-ken, JP (2009)
- Tokyo, JP (2003 - 2016)
Company Filing History:
8 out of 2,512 
1 out of 164,219 
1 out of 10 
Years Active: 2003-2016
Title: Ryoichi Kimizuka: Innovator in Copper Plating Technology
Introduction
Ryoichi Kimizuka is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of copper plating technology, holding a total of 10 patents. His innovative techniques have advanced the capabilities of semiconductor manufacturing.
Latest Patents
One of his latest patents is a copper plating bath containing a tertiary amine compound and its use. This invention provides a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates, such as silicon, organic material, or ceramic substrates. The technique involves a tertiary amine compound, which is synthesized by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group from a compound that has three or more glycidyl ether groups. Additionally, it includes a quaternary amine compound, a copper plating additive, a copper plating bath, and a method for copper plating utilizing these compounds.
Another notable patent is a plating apparatus and method that allows for the mechanical and electrochemical preferential deposition of a plated film in fine interconnect recesses, such as trenches and via holes. This method includes positioning a substrate with fine interconnect recesses so that a conductive layer faces an anode, placing a porous member between the substrate and the anode, and filling a plating solution in the gap. The process involves holding the conductive layer and the porous member in contact, passing an electric current, and stopping the current supply at intervals.
Career Highlights
Throughout his career, Ryoichi Kimizuka has worked with notable companies, including Ebara Corporation. His work has focused on enhancing the efficiency and effectiveness of copper plating processes, which are critical in the semiconductor industry.
Collaborations
Ryoichi has collaborated with talented individuals such as Mizuki Nagai and Akihisa Hongo, contributing to the advancement of technology in his field.
Conclusion
Ryoichi Kimizuka's innovative work in copper plating technology has significantly impacted the semiconductor industry. His patents reflect a deep understanding of the complexities involved in plating processes, showcasing his expertise and dedication to innovation.