The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2003
Filed:
Apr. 27, 2001
Applicant:
Inventors:
Yasushi Isayama, Tokyo, JP;
Hiroyuki Ueyama, Tokyo, JP;
Hiroyuki Kaneko, Tokyo, JP;
Junitsu Yamakawa, Tokyo, JP;
Akihisa Hongo, Tokyo, JP;
Ryoichi Kimizuka, Tokyo, JP;
Megumi Maruyama, Kanagawa, JP;
Assignee:
Ebara Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 2/742 ;
U.S. Cl.
CPC ...
G01N 2/742 ;
Abstract
The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.