Company Filing History:
Years Active: 2003-2007
Title: Megumi Maruyama: Innovator in Semiconductor Plating Technologies
Introduction
Megumi Maruyama is a prominent inventor based in Kanagawa, Japan. She has made significant contributions to the field of semiconductor technology, particularly in the area of plating processes. With a total of five patents to her name, Maruyama's work has advanced the efficiency and effectiveness of semiconductor manufacturing.
Latest Patents
Among her latest patents is a method of managing a plating liquid used in a plating apparatus. This innovative approach determines the concentration of a leveler in a plating liquid based on a peak area (Ar value) in a peel-off region, measured according to a CV or CVS process. Another notable patent is her substrate plating method and apparatus, which efficiently fills fine recesses in semiconductor substrates with plating metal, ensuring no voids or contamination. This process includes an electroless plating step to form an initial layer, followed by an electrolytic plating step to fill the wiring recess.
Career Highlights
Megumi Maruyama is currently employed at Ebara Corporation, where she continues to develop cutting-edge technologies in semiconductor plating. Her expertise and innovative mindset have positioned her as a key player in her field.
Collaborations
Throughout her career, Maruyama has collaborated with notable colleagues, including Akihisa Hongo and Ryoichi Kimizuka. These partnerships have fostered a collaborative environment that enhances the development of new technologies.
Conclusion
Megumi Maruyama's contributions to semiconductor plating technologies exemplify her innovative spirit and dedication to advancing the industry. Her patents reflect her commitment to improving manufacturing processes, making her a significant figure in the field.