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For the Inventor, By the Inventor

Tokyo, Japan

Junitsu Yamakawa

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.3

ph-index = 4

Forward Citations = 48(Granted Patents)


Company Filing History:

goldMedal14 out of 2,510 
 
Ebara Corporation
 patents

Years Active: 2002-2023

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14 patents (USPTO):Explore Patents
1. 11781233 - Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank (2023-10-10),
2. 11767606 - Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank (2023-09-26),
3. 11600514 - Substrate holding device (2023-03-07),
4. 11230780 - Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank (2022-01-25),
5. 11015261 - Substrate holder and plating apparatus (2021-05-25),
6. 10991605 - Substrate processing device, method for controlling substrate processing device, and storage medium storing a program (2021-04-27),
7. 10781530 - Cleaning apparatus, plating apparatus using the same, and cleaning method (2020-09-22),
8. 10163672 - Substrate processing device, method for controlling substrate processing device, and storage medium storing programs (2018-12-25),
9. 7172683 - Method of managing a plating liquid used in a plating apparatus (2007-02-06),
10. RE39123 - Plating apparatus (2006-06-12),
11. 6793794 - Substrate plating apparatus and method (2004-09-21),
12. 6627066 - Method of measuring the concentration of a leveler in a plating liquid (2003-09-30),
13. 6379520 - Plating apparatus (2002-04-30),
14. 6365017 - Substrate plating device (2002-04-02),

Title: Innovations of Junitsu Yamakawa

Introduction

Junitsu Yamakawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of plating technology, holding a total of 14 patents. His work focuses on the development of innovative materials and methods that enhance the efficiency and effectiveness of plating processes.

Latest Patents

Yamakawa's latest patents include a copper oxide solid designed for use in plating a substrate. This invention utilizes an insoluble anode and outlines a method for producing the copper oxide solid. Additionally, he has developed an apparatus for supplying a plating solution into a plating tank, where the copper oxide solid is dissolved. The copper oxide solid consists of a copper oxide powder combined with a liquid binder to solidify the powder, ensuring optimal performance in plating applications.

Career Highlights

Yamakawa is currently employed at Ebara Corporation, a leading company in the field of advanced technology and engineering solutions. His work at Ebara has allowed him to focus on innovative solutions that address the challenges faced in the plating industry. His expertise and dedication have positioned him as a key figure in the development of new plating technologies.

Collaborations

Throughout his career, Yamakawa has collaborated with notable colleagues, including Hiroyuki Ueyama and Akihisa Hongo. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Junitsu Yamakawa's contributions to the field of plating technology through his innovative patents and collaborative efforts highlight his importance as an inventor. His work continues to influence advancements in the industry, showcasing the potential of copper oxide materials in plating applications.

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