The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Mar. 07, 2017
Applicant:

Ebara Corporation;

Inventors:

Yoshitaka Mukaiyama, Tokyo, JP;

Toshio Yokoyama, Tokyo, JP;

Junitsu Yamakawa, Tokyo, JP;

Takuya Tsushima, Tokyo, JP;

Tomonori Hirao, Tokyo, JP;

Sho Tamura, Tokyo, JP;

Hirotaka Ohashi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/06 (2006.01); C25D 17/08 (2006.01); C25D 17/00 (2006.01); C25D 7/12 (2006.01); H01L 21/67 (2006.01); B65G 49/02 (2006.01); H01L 21/683 (2006.01); H05K 3/18 (2006.01); B65G 47/52 (2006.01); C25D 5/34 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C25D 17/06 (2013.01); B65G 47/52 (2013.01); B65G 49/02 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 17/004 (2013.01); C25D 17/005 (2013.01); C25D 17/007 (2013.01); C25D 17/08 (2013.01); H01L 21/6723 (2013.01); H01L 21/683 (2013.01); H05K 3/18 (2013.01); C25D 5/34 (2013.01); H05K 1/0271 (2013.01); H05K 3/188 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/1509 (2013.01);
Abstract

To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.


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