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For the Inventor, By the Inventor

Tokyo, Japan

Toshio Yokoyama

This inventor holds 37 USPTO granted patents and 9 published patent applications, primarily in Substrate Processing. Top assignees: Ebara Corporation, Ss Pharmaceutical Co., Ltd., Kabushiki Raisha Kotobuki. Active years: 1989-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshio Yokoyama. Retrieved from https://idiyas.com/inventor/toshio-yokoyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 37 

% Patents Active = 86.5

Average Co-Inventor Count = 4.4

ph-index = 5

Forward Citations = 75(Granted Patents)


Company Filing History:

goldMedal32 out of 2,576 
 
Ebara Corporation
 patents
silverMedal3 out of 90 
 
Ss Pharmaceutical Co., Ltd.
 patents
bronzeMedal1 out of 1 
 
Kabushiki Raisha Kotobuki
 patent
4. 1 out of 27 
 
Ssp Co. Ltd
 patents

Years Active: 1989-2024

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Areas of Expertise:
Substrate Processing Apparatus
Plating Apparatus
Copper Oxide Solid
Substrate Transfer Method
Rinsing Bath
Substrate Polishing
Control Method
Supply-Liquid Producing
Lifting Device
Medicinal Compositions
Dosage-Form Vitamins
Plating System
37 patents (USPTO):Explore Patents
1. 12027402 - Substrate processing apparatus and substrate processing method (2024-07-02),
2. 12020954 - Substrate processing apparatus (2024-06-25),
3. 11781233 - Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank (2023-10-10),
4. 11767606 - Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank (2023-09-26),
5. 11434580 - Plating apparatus (2022-09-06),
6. 11332838 - Plating apparatus (2022-05-17),
7. 11230780 - Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank (2022-01-25),
8. 11098414 - Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method (2021-08-24),
9. 11024520 - Substrate processing apparatus (2021-06-01),
10. 11015261 - Substrate holder and plating apparatus (2021-05-25),
11. 10665495 - Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device (2020-05-26),
12. 10654017 - Supply-liquid producing apparatus and supply-liquid producing method (2020-05-19),
13. 10501862 - Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method (2019-12-10),
14. 10468274 - Substrate processing apparatus (2019-11-05),
15. 10160013 - Rinsing bath and substrate cleaning method using such rinsing bath (2018-12-25),

Title: Toshio Yokoyama: Innovator in Substrate Processing Technology

Introduction

Toshio Yokoyama is a prominent inventor based in Tokyo, Japan, known for his significant contributions to substrate processing technology. With an impressive portfolio of 37 patents, he has dedicated his career to advancing techniques and apparatuses that improve substrate handling and processing.

Latest Patents

Among his latest inventions, Yokoyama has developed a substrate processing apparatus and a substrate processing method. The apparatus is designed to process a substrate using a processing liquid. It features a support portion for placing the substrate, a processing tank for supplying the processing liquid, and an elevating portion that allows for the substrate to be lowered and raised from the tank. Additionally, the gripping portion of the apparatus secures the substrate, while a first nozzle emits gas onto the substrate to aid in drying. His method includes an adjusting system that coordinates sensors to ensure the substrate's placement is precise, checking the position of characteristic points for accuracy, and allowing for real-time adjustments during the processing phase.

Career Highlights

Yokoyama has worked with notable companies, including Ebara Corporation and Ss Pharmaceutical Co., Ltd., where he has honed his innovative skills and expanded his expertise in substrate processing technologies. His numerous patents reflect his commitment to improving efficiency and precision in these critical operations.

Collaborations

Throughout his career, Toshio Yokoyama has collaborated with esteemed colleagues such as Masahiko Sekimoto and Kenichi Kobayashi. These partnerships have fostered a dynamic environment for innovation, driving forward advancements in substrate processing methods that benefit various industries.

Conclusion

Toshio Yokoyama's contributions to substrate processing technology have been transformative. His inventive spirit and dedication to improving processing methodologies significantly impact the field, making him a notable figure among inventors in Japan. As he continues to develop groundbreaking technologies, Yokoyama remains a key player in enhancing substrate processing efficiency and effectiveness.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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