Ebara Corporation

Ss Pharmaceutical Co., Ltd.

Ssp Co. Ltd

Kabushiki Raisha Kotobuki

Toshio Yokoyama

Masahiko Sekimoto

Kenichi Kobayashi

Seiji Katsuoka

Mitsuru Miyazaki

Teruyuki Watanabe

Takahiro Ogawa

Junji Kunisawa

Takashi Mitsuya

Junitsu Yamakawa

Akira Owatari

Keiichi Kurashina

Tomonori Hirao

Naoki Dai

Kenichi Suzuki

Yasuyuki Motoshima

Hirotaka Ohashi

Kenichi Akazawa

Takuya Tsushima

Risa Kimura

Yasuyuki Motojima

Chunhui Dou

Susumu Sato

Masashi Shimoyama

Akira Iwasa

Ryuya Koizumi

Yoshitaka Mukaiyama

Kunio Oishi

Masayuki Kumekawa

Ryo Kato

Hiroshi Hasegawa

Noriaki Shioiri

Gaku Yamasaki

Koichi Tachibana

Kazuo Yamazaki

Noriyuki Kawamoto

Tadashi Mikami

Masami Moroi

Hiroyuki Shinozaki

Yoichi Nakagawa

Hiroaki Inoue

Masaya Seki

Mizuki Nagai

Hideo Aizawa

Hideaki Matsuda

Tadakazu Sone

Takahiro Abe

Hiroshi Aono

Sho Tamura

Hiroshi Sotozaki

Naoki Toyomura

Suguru Ozawa

Akihiro Yazawa

Kenji Shinkai

Akira Ogata

Teruaki Hombo

Tao Xu

Hiroyuki Naito

Junji Okawa

Ryu Miyamoto

Koji Kusano

Shinichi Morimoto

Muneto Takahashi

Kimie Ominato

An adjusting system is controlled such that an arrangement of the substrate is adjusted based on detection by a first sensor, and a second sensor is controlled to detect a characteristic point formed in advance on a plate surface of the substrate, wherein the arrangement of the substrate has been adjusted based on the detection by the first sensor. Moreover, it is checked whether a position of the characteristic point detected by the second sensor is within an allowable range, and the adjusting system is controlled to adjust the arrangement of the substrate based on the detection by the second sensor when the position of the characteristic point detected by the second sensor is within the allowable range, and the attaching/detaching system is controlled to attach the substrate to the substrate holder after the arrangement of the substrate is adjusted based on the detection by the second sensor.

Substrate processing apparatus and substrate processing method

The present invention relates to a substrate processing apparatus for processing a substrate with a processing liquid. The substrate processing apparatus according to one embodiment includes: a support portion having a placement surface on which a substrate is placed in a horizontal posture; a processing tank configured to supply a processing liquid to the substrate and process the substrate; an elevating portion configured to raise and lower the support portion in order to lower the substrate into the processing tank and raise the substrate from the processing tank; a gripping portion configured to grip a periphery of the substrate supported by the support portion above the processing tank, and receive the substrate from the support portion; and a first nozzle configured to emit a gas onto the substrate, gripped by the gripping portion, to dry the substrate.

Substrate processing apparatus

The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.

Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank

To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.

Plating apparatus

A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other.

A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method

The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.

To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

Substrate holder and plating apparatus

A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.

Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device

Provided is a supply-liquid producing apparatus capable of producing a supply liquid by an amount needed at a use point. A supply-liquid producing apparatus includes a mixer that mixes water and ozone gas to produce ozone water; a booster pump that increases the pressure of the water supplied to the mixer; a gas-liquid separation tank that separates the ozone water produced by the mixer into ozone water to be supplied to a use point and exhaust gas to be discharged from an exhaust port; a flowmeter that measures the flow rate of the ozone water supplied from the gas-liquid separation tank to the use point; a flow control unit that adjusts the (flow rate of the water supplied to the mixer by controlling the booster pump in response to the flow rate of the ozone water measured by the flowmeter; and an exhaust pressure control unit that controls the exhaust pressure to keep constant the water level in the gas-liquid separation tank.

Supply-liquid producing apparatus and supply-liquid producing method

A rinsing bath which can simplify a discharging structure of a rinsing liquid is disclosed. The rinsing bath includes an inner bath for storing the rinsing liquid, an overflow bath configured to receive the rinsing liquid overflowing the inner bath, a stopper for closing a drain hole provided on a bottom of the inner bath, an actuator configured to move the stopper between a closing position in which the stopper closes the drain hole and a opening position in which the stopper is away from the drain hole, a rinsing liquid supply pipe configured to supply the rinsing liquid into the inner bath, and a drain pipe coupled to a bottom of the overflow bath. The drain hole communicates between an inside of the inner bath and an inside of the overflow bath.

Rinsing bath and substrate cleaning method using such rinsing bath

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Tokyo, Japan

Toshio Yokoyama