The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Nov. 18, 2021
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Junitsu Yamakawa, Tokyo, JP;
Chunhui Dou, Tokyo, JP;
Risa Kimura, Tokyo, JP;
Toshio Yokoyama, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); C25D 21/14 (2006.01); B22F 1/00 (2022.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); B22F 1/00 (2013.01); C25D 7/12 (2013.01); C25D 17/001 (2013.01); C25D 21/14 (2013.01);
Abstract
The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.