Tokyo, Japan

Chunhui Dou

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022-2023

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3 patents (USPTO):Explore Patents

Title: Innovations of Chunhui Dou in Plating Technology

Introduction

Chunhui Dou is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of plating technology, particularly through his innovative patents. With a total of three patents to his name, Dou's work focuses on enhancing the efficiency and effectiveness of plating processes.

Latest Patents

Chunhui Dou's latest patents include a copper oxide solid for use in plating of a substrate, a method of producing the copper oxide solid, and an apparatus for supplying a plating solution into a plating tank. The present invention relates to a copper oxide solid designed for plating a substrate using an insoluble anode. Additionally, the method of producing the copper oxide solid is outlined, along with an apparatus that facilitates the dissolution of the copper oxide solid into a plating tank. The copper oxide solid (CS) intended for use in the plating solution comprises a copper oxide powder combined with a liquid binder to solidify the powder.

Career Highlights

Chunhui Dou is currently employed at Ebara Corporation, where he continues to develop innovative solutions in the plating industry. His work has garnered attention for its practical applications and potential to improve existing technologies.

Collaborations

Some of his coworkers include Junitsu Yamakawa and Risa Kimura, who contribute to the collaborative environment at Ebara Corporation.

Conclusion

Chunhui Dou's contributions to plating technology through his patents demonstrate his commitment to innovation and advancement in the field. His work not only enhances the efficiency of plating processes but also showcases the importance of collaboration in achieving technological breakthroughs.

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