Tokyo, Japan

Tomonori Hirao

USPTO Granted Patents = 10 

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016-2024

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10 patents (USPTO):

Title: Innovations by Tomonori Hirao

Introduction

Tomonori Hirao is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate processing, holding a total of 10 patents. His work focuses on enhancing the efficiency and effectiveness of substrate handling and processing methods.

Latest Patents

Hirao's latest patents include a substrate processing apparatus and a substrate processing method. The substrate processing apparatus features an adjusting system that is controlled to adjust the arrangement of the substrate based on detection by a first sensor. A second sensor detects a characteristic point on the substrate's surface, ensuring that the arrangement is accurate. The system checks whether the detected position is within an allowable range and adjusts accordingly. Additionally, the substrate holding apparatus he developed is designed to hold substrates effectively, featuring a grasp module and a suction module to secure the substrate during processing.

Career Highlights

Tomonori Hirao has had a successful career at Ebara Corporation, where he has been instrumental in developing innovative technologies related to substrate processing. His expertise has led to advancements that improve the quality and precision of substrate handling in various applications.

Collaborations

Hirao has collaborated with notable colleagues, including Toshio Yokoyama and Takuya Tsushima, to further enhance the capabilities of their technologies. Their teamwork has contributed to the successful development of several patents and innovations in the field.

Conclusion

Tomonori Hirao's contributions to substrate processing technology have made a significant impact in his field. His innovative patents and collaborative efforts continue to drive advancements in substrate handling and processing methods.

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