The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2006
Filed:
Nov. 25, 1999
Fumio Kuriyama, Tokyo, JP;
Hiroyuki Ueyama, Tokyo, JP;
Junitsu Yamakawa, Tokyo, JP;
Kenichi Suzuki, Tokyo, JP;
Atsushi Chono, Tokyo, JP;
Fumio Kuriyama, Tokyo, JP;
Hiroyuki Ueyama, Tokyo, JP;
Junitsu Yamakawa, Tokyo, JP;
Kenichi Suzuki, Tokyo, JP;
Atsushi Chono, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.