Tokyo, Japan

Mizuki Nagai

This inventor holds 42 USPTO granted patents and 12 published patent applications and 1 EPO patent, primarily in Plating Technology. Top assignees: Ebara Corporation, International Business Machines Corporation, Other. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mizuki Nagai. Retrieved from https://idiyas.com/inventor/mizuki-nagai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 42 

% Patents Active = 78.6

 

Average Co-Inventor Count = 3.4

ph-index = 5

Forward Citations = 108(Granted Patents)


Location History:

  • Fujisawa, JP (2003 - 2004)
  • Tokyo, JP (2002 - 2024)

Company Filing History:


Years Active: 2002-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Plating Method
Electroplating
Substrate Processing
Anode Holder
Plating Apparatus
Resistance Measuring
Copper-Plating
Substrate Holder
Cleaning Method
Non-Volatile Storage
Plating Device
Recording Medium
42 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Mizuki Nagai

Introduction

Mizuki Nagai is a prominent inventor based in Tokyo, Japan, known for his innovative contributions to the field of plating technology. With an impressive portfolio of 37 patents, Nagai has made significant advancements aimed at improving the efficiency and effectiveness of plating processes.

Latest Patents

One of Mizuki Nagai's latest patents is a unique plating method and apparatus designed to save a substrate in the event of a failure in a transporter, plating tank, or other components during the plating process. This groundbreaking method involves transporting multiple substrates to assigned plating tanks, immersing them in a plating solution, detecting any failure, and then substituting the plating solution with a preservative liquid to protect the substrates.

Another significant invention by Nagai is a plating method featuring an insoluble anode and a plating apparatus that reduces additive consumption in the plating solution. This method prepares substrates with vias or holes for forming through electrodes and utilizes a divided plating solution tank. The electroplating process is optimized by maintaining a current density between 0.4 ASD and 1.4 ASD, enhancing the plating's effectiveness while conserving resources.

Career Highlights

Mizuki Nagai has had a successful career, working for notable companies, including Ebara Corporation and IBM. His experiences in these prestigious organizations have equipped him with valuable insights and expertise in the field of plating technology.

Collaborations

Throughout his career, Mizuki Nagai has collaborated with talented professionals like Masashi Shimoyama and Koji Mishima. These partnerships have fostered a dynamic environment for innovation and have contributed to the advancements in plating technologies that Nagai is known for.

Conclusion

In summary, Mizuki Nagai's innovative spirit and commitment to improving plating processes have resulted in a remarkable collection of patents that push the boundaries of technology. His work not only highlights his ingenuity but also showcases the potential for further advancements in the plating industry, setting a benchmark for future inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…