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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11319642 B1

PDFFull Text
Date of Patent:
May. 03, 2022

Filed:

Jan. 26, 2021

Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate

Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Mitsuhiro Shamoto, Tokyo, JP;

Mizuki Nagai, Tokyo, JP;

Naoto Takahashi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:

BakerHostetler

Primary Examiner:

Harry D Wilkins, III

Assistant Examiner:

Ho-Sung Chung

Int. Cl.
CPC ...
C25D 17/00 (2006.01); H01L 21/288 (2006.01); H01L 23/00 (2006.01); C25D 21/12 (2006.01); H01L 21/768 (2006.01); C25D 21/10 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); C25D 21/12 (2013.01); H01L 21/2885 (2013.01); H01L 24/742 (2013.01); C25D 17/008 (2013.01); C25D 21/10 (2013.01); H01L 21/76879 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01);
Abstract

To optimize a location of a power feeding point with the use of a square substrate. There is disclosed a method for determining a location of a power feeding point in an electroplating apparatus. The electroplating apparatus is configured to plate a rectangular substrate having a substrate area of S. The rectangular substrate has opposed two sides coupled to a power supply. The rectangular substrate has a length L of the sides coupled to the power supply and a length W of sides not coupled to the power supply meeting a condition of 0.8×L≤W≤L. The method includes determining a number N of the power feeding points according to the substrate area S.

Find Patent Forward Citations

Shamoto, Mitsuhiro. (2022). Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate (U.S. Patent No. 11319642). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11319642

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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