The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2007

Filed:

Dec. 26, 2002
Applicants:

Akihisa Hongo, Tokyo, JP;

Xinming Wang, Tokyo, JP;

Inventors:

Akihisa Hongo, Tokyo, JP;

Xinming Wang, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/469 (2006.01); B08B 3/00 (2006.01); B05C 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate processing apparatus has a substrate holder for detachably holding a substrate so that a surface, to be processed, of the substrate faces downward, and a sealing ring for sealing a peripheral portion of the surface, to be processed, of the substrate held by the substrate holder. The substrate processing apparatus also has a plurality of ejection nozzles disposed below the substrate holder for ejecting a treatment solution toward the surface, to be processed, of the substrate held by the substrate holder, and a mechanism for rotating and vertically moving the substrate holder and the ejection nozzles relative to each other.


Find Patent Forward Citations

Hongo, Akihisa. (2007). Substrate processing apparatus and method (U.S. Patent No. 7172979). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7172979

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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