The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Sep. 05, 2001
Akihisa Hongo, Yokohama, JP;
Naoaki Ogure, Tokyo, JP;
Hiroaki Inoue, Machida, JP;
Norio Kimura, Fujisawa, JP;
Fumio Kuriyama, Yokohama, JP;
Manabu Tsujimura, Yokohama, JP;
Kenichi Suzuki, Fujisawa, JP;
Atsushi Chono, Fujisawa, JP;
Akihisa Hongo, Yokohama, JP;
Naoaki Ogure, Tokyo, JP;
Hiroaki Inoue, Machida, JP;
Norio Kimura, Fujisawa, JP;
Fumio Kuriyama, Yokohama, JP;
Manabu Tsujimura, Yokohama, JP;
Kenichi Suzuki, Fujisawa, JP;
Atsushi Chono, Fujisawa, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.