logo

For the Inventor, By the Inventor

Kaohsiung, Taiwan

Walton Advanced Engineering Inc.


USPTO Granted Patents = 47

% Expired Patents = 40.4


Trademarks = 4

Forward Citations = 188

Loading Chart...
Loading Chart...

13 inventors (with patents filed for the assignee):

goldMedal Hong-Chi Yu (30 out of 30 patents)

silverMedal Mao-Ting Chang (13 out of 13 patents)

bronzeMedal Hong Chi Yu (9 out of 9 patents)

4.  Ruei-Ting Gu (9 out of 11 patents)

5.  Chun-jung Lin (9 out of 9 patents)

6.  Mao Ting Chang (8 out of 8 patents)

7.  Kuo-Yuan Lee (5 out of 6 patents)

8.  Yung-Hsiang Chen (5 out of 5 patents)

9.  Chun Jung Lin (3 out of 3 patents)

10.  Wen-Chun Chiu (3 out of 3 patents)

11.  Ruei Ting Gu (2 out of 2 patents)

12.  Yu Hong-Chi (1 out of 1 patent)

13.  Tse-Ming Lin (1 out of 1 patent)


Core Competencies:
Chip Package
EMI Shielding
Multi-Chip Stacking
High-Density Module
Data Retention
Device Authentication
Network Storage
Heat Dissipation
USB Device
Composite Structure
Folding Structure
Digital Storage

47 patents:

1. 12708020 - Chip package having a glass fiber substrate (2026-08-11),
2. 12648447 - Chip package with electromagnetic interference (EMI) shielding layer and ground wire and method of manufacturing the same (2026-06-02),
3. 12635525 - Chip package having four sides provided with electromagnetic interference shielding layers and method of manufacturing the same (2026-05-19),
4. 12628661 - Chip package having die pad with protective layer (2026-05-12),
5. 12628654 - Chip package with electromagnetic interference shielding layer and method of manufacturing the same (2026-05-12),
6. 12568847 - Chip package and method of manufacturing the same (2026-03-03),
7. 12532760 - Chip package unit, method of manufacturing the same, and package structure formed by stacking the same (2026-01-20),
8. 12512448 - Multi-layer stacked chip package (2025-12-30),
9. 12482771 - Chip package with higher bearing capacity in wire bonding (2025-11-25),
10. 12355730 - Method for construction of a high-security private group network (2025-07-08),
11. 11869876 - Thinning system in package (2024-01-09),
12. 11587854 - System in package (2023-02-21),
13. 11245688 - Device authentication method (2022-02-08),
14. 11036893 - Data retention method (2021-06-15),
15. 10693960 - Data exchange guide device and an execution method thereof (2020-06-23),
Walton Advanced Engineering Inc. is a prominent player in the field of advanced engineering solutions, specializing in the development and manufacturing of high-tech components and systems. Based in Kaohsiung, Taiwan, the company focuses on innovative technologies that cater to various industries, including automotive, electronics, and telecommunications. With a commitment to research and development, Walton Advanced Engineering aims to enhance product performance and reliability through cutting-edge engineering practices and solutions.
Profile summary based on public USPTO records.

logo

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

47 Patents

#15 in Kaohsiung

#421 in Taiwan

#14,796 in the World

Kaohsiung, TW
Kaohsiung, Taiwan

Walton Advanced Engineering Inc.

Forward Citations = 188

13 inventors:

goldMedal Hong-Chi Yu (30 out of 30 patents)

silverMedal Mao-Ting Chang (13 out of 13 patents)

bronzeMedal Hong Chi Yu (9 out of 9 patents)

4.  Ruei-Ting Gu (9 out of 11 patents)

5.  Chun-jung Lin (9 out of 9 patents)

Please report any incorrect information to [email protected]
Loading…