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Kaohsiung, Taiwan

Walton Advanced Engineering Inc.

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USPTO Granted Patents = 47

% Expired Patents = 40.4

EPO Patents = 11

Trademarks = 4

Forward Citations = 189

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13 inventors (with patents filed for the assignee):

Hong-Chi Yu (30 out of 30 patents)

Mao-Ting Chang (13 out of 13 patents)

Hong Chi Yu (9 out of 9 patents)

4. Ruei-Ting Gu (9 out of 11 patents)

5. Chun-jung Lin (9 out of 9 patents)

6. Mao Ting Chang (8 out of 8 patents)

7. Kuo-Yuan Lee (5 out of 6 patents)

8. Yung-Hsiang Chen (5 out of 5 patents)

9. Chun Jung Lin (3 out of 3 patents)

10. Wen-Chun Chiu (3 out of 3 patents)

11. Ruei Ting Gu (2 out of 2 patents)

12. Yu Hong-Chi (1 out of 1 patent)

13. Tse-Ming Lin (1 out of 1 patent)

Core Competencies:

Chip Package

EMI Shielding

Multi-Chip Stacking

High-Density Module

Data Retention

Device Authentication

Network Storage

Heat Dissipation

USB Device

Composite Structure

Folding Structure

Digital Storage

47 patents: Sort by Forward Citations

1. 12708020 - Chip package having a glass fiber substrate (2026-08-11),

2. 12648447 - Chip package with electromagnetic interference (EMI) shielding layer and ground wire and method of manufacturing the same (2026-06-02),

3. 12635525 - Chip package having four sides provided with electromagnetic interference shielding layers and method of manufacturing the same (2026-05-19),

4. 12628661 - Chip package having die pad with protective layer (2026-05-12),

5. 12628654 - Chip package with electromagnetic interference shielding layer and method of manufacturing the same (2026-05-12),

6. 12568847 - Chip package and method of manufacturing the same (2026-03-03),

7. 12532760 - Chip package unit, method of manufacturing the same, and package structure formed by stacking the same (2026-01-20),

8. 12512448 - Multi-layer stacked chip package (2025-12-30),

9. 12482771 - Chip package with higher bearing capacity in wire bonding (2025-11-25),

10. 12355730 - Method for construction of a high-security private group network (2025-07-08),

11. 11869876 - Thinning system in package (2024-01-09),

12. 11587854 - System in package (2023-02-21),

13. 11245688 - Device authentication method (2022-02-08),

14. 11036893 - Data retention method (2021-06-15),

15. 10693960 - Data exchange guide device and an execution method thereof (2020-06-23),

Company Overview

Walton Advanced Engineering Inc. is a prominent player in the field of advanced engineering solutions, specializing in the development and manufacturing of high-tech components and systems. Based in Kaohsiung, Taiwan, the company focuses on innovative technologies that cater to various industries, including automotive, electronics, and telecommunications. With a commitment to research and development, Walton Advanced Engineering aims to enhance product performance and reliability through cutting-edge engineering practices and solutions.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

47 Patents

#15 in Kaohsiung

#421 in Taiwan

#14,840 in the World

Kaohsiung, Taiwan

Walton Advanced Engineering Inc.

Forward Citations = 189

13 inventors:

Hong-Chi Yu (30 out of 30 patents)

Mao-Ting Chang (13 out of 13 patents)

Hong Chi Yu (9 out of 9 patents)

4. Ruei-Ting Gu (9 out of 11 patents)

5. Chun-jung Lin (9 out of 9 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Walton Advanced Engineering Inc.. Retrieved from https://idiyas.com/company/walton-advanced-engineering

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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