The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Jun. 22, 2021
Applicant:

Walton Advanced Engineering Inc., Kaohsiung, TW;

Inventors:

Chun Jung Lin, Kaohsiung, TW;

Ruei Ting Gu, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49 (2013.01); H01L 23/3107 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48245 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06582 (2013.01);
Abstract

The present application describes a system in package which features no printed circuit board inside an encapsulation structure and comprises: a copper holder with a silicon layer at a top face; a plurality of dies mounted on the silicon layer and electrically connected to a plurality of data pins of the copper holder; a passive element mounted on the silicon layer and electrically connected to the dies wherein the dies are electrically connected to the ground pin of the copper holder; a molding compound encasing the dies and the passive element on the top face of the copper holder.


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