This inventor holds 11 USPTO granted patents and 26 published patent applications. Top assignees: Walton Advanced Engineering Inc., Other. Active years: 2013-2026.
Company Filing History:
9 out of 47 
2 out of 834,411 Years Active: 2013-2026
Title: Ruei-Ting Gu: Innovator in Chip Packaging Technology
Introduction
Ruei-Ting Gu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 11 patents. His innovative designs focus on enhancing the performance and reliability of semiconductor devices.
Latest Patents
Among his latest patents is a chip package with an electromagnetic interference (EMI) shielding layer and ground wire, along with a method of manufacturing the same. This invention provides a chip package that includes a chip package unit, at least one EMI shielding layer, and at least one ground wire. The ground wire is designed to protect against static electricity, thereby preventing malfunctions in electronic systems that utilize semiconductor chips. Another notable patent involves a chip package that features four sides equipped with EMI shielding layers. This design not only protects the internal circuit layers from electromagnetic interference but also improves heat dissipation efficiency.
Career Highlights
Ruei-Ting Gu has worked with Walton Advanced Engineering Inc., where he has applied his expertise in chip packaging technology. His work has significantly impacted the development of reliable semiconductor devices.
Collaborations
Some of his notable coworkers include Hong-Chi Yu and Chun-jung Lin, who have collaborated with him on various projects in the field of chip packaging.
Conclusion
Ruei-Ting Gu's innovative contributions to chip packaging technology have established him as a key figure in the industry. His patents reflect a commitment to improving the performance and reliability of electronic systems.