For the Inventor, By the Inventor

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San Diego, CA, United States of America

Ormet Circuits, Inc.

USPTO Granted Patents = 12

EPO Patents = 4

Trademarks = 1

Forward Citations = 45

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15 inventors (with patents filed for the assignee):

Catherine A Shearer (10 out of 10 patents)

Michael C Matthews (6 out of 8 patents)

Kenneth C Holcomb (4 out of 4 patents)

4. G Delbert Friesen (3 out of 3 patents)

5. Eunsook Barber (2 out of 2 patents)

6. Peter A Matturri (2 out of 2 patents)

7. Matthew Wrosch (1 out of 1 patent)

8. Ping-Hung Lu (1 out of 31 patents)

9. Peter A Matturi (1 out of 1 patent)

10. Richard Weaver (1 out of 1 patent)

11. Khang Duy Tran (1 out of 1 patent)

12. Ken Holcomb (1 out of 1 patent)

13. Chunwei Chen (1 out of 11 patents)

14. Christopher A Hunrath (1 out of 2 patents)

15. Pradeep R Gandhi (1 out of 6 patents)

12 patents: Sort by Forward Citations

1. 12388004 - Lithographically defined electrical interconnects from conductive pastes (2025-08-12),

2. 12053934 - Conductive film adhesive (2024-08-06),

3. 11440142 - Alternative compositions for high temperature soldering applications (2022-09-13),

4. 11217554 - Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof (2022-01-04),

5. 10727193 - Sintering pastes with high metal loading for semiconductor die attach applications (2020-07-28),

6. 9583453 - Semiconductor packaging containing sintering die-attach material (2017-02-28),

7. 9545017 - Structures for z-axis interconnection of multilayer electronic substrates (2017-01-10),

8. 9005330 - Electrically conductive compositions comprising non-eutectic solder alloys (2015-04-14),

9. 9003648 - Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias (2015-04-14),

10. 8840700 - Preparation of metallurgic network compositions and methods of use thereof (2014-09-23),

11. 8221518 - Conductive compositions containing blended alloy fillers (2012-07-17),

12. 6716036 - Method of attaching circuitry to a modular jack connector using electrically conductive paste (2004-04-06),

Ormet Circuits, Inc. is a leading provider of advanced printed circuit board solutions for a wide range of industries. With expertise in HDI, flex, rigid-flex, and multilayer PCBs, Ormet Circuits delivers high-quality products to meet the most demanding specifications. From prototyping to full production runs, Ormet Circuits is a trusted partner for innovative companies looking for reliable PCB solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

12 Patents

#421 in San Diego, CA

#5,871 in California

#24,779 in US

#46,665 in the World

San Diego, CA, United States of America

Ormet Circuits, Inc.

Forward Citations = 45

15 inventors:

Catherine A Shearer (10 out of 10 patents)

Michael C Matthews (6 out of 8 patents)

Kenneth C Holcomb (4 out of 4 patents)

4. G Delbert Friesen (3 out of 3 patents)

5. Eunsook Barber (2 out of 2 patents)

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