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For the Inventor, By the Inventor

San Diego, CA, United States of America

Ormet Circuits, Inc.

Calculating rank
USPTO Granted Patents = 13


Forward Citations = 50

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15 inventors (with patents filed for the assignee):

goldMedal Catherine A Shearer (11 out of 11 patents)

silverMedal Michael C Matthews (6 out of 8 patents)

bronzeMedal Kenneth C Holcomb (4 out of 4 patents)

4.  G Delbert Friesen (3 out of 3 patents)

5.  Eunsook Barber (2 out of 2 patents)

6.  Peter A Matturri (2 out of 2 patents)

7.  Matthew Wrosch (1 out of 1 patent)

8.  Ping-Hung Lu (1 out of 31 patents)

9.  Peter A Matturi (1 out of 1 patent)

10.  Richard Weaver (1 out of 1 patent)

11.  Khang Duy Tran (1 out of 1 patent)

12.  Ken Holcomb (1 out of 1 patent)

13.  Chunwei Chen (1 out of 12 patents)

14.  Christopher A Hunrath (1 out of 2 patents)

15.  Pradeep R Gandhi (1 out of 6 patents)


13 patents:

1. 12564907 - Indium solder paste compositions (2026-03-03),
2. 12388004 - Lithographically defined electrical interconnects from conductive pastes (2025-08-12),
3. 12053934 - Conductive film adhesive (2024-08-06),
4. 11440142 - Alternative compositions for high temperature soldering applications (2022-09-13),
5. 11217554 - Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof (2022-01-04),
6. 10727193 - Sintering pastes with high metal loading for semiconductor die attach applications (2020-07-28),
7. 9583453 - Semiconductor packaging containing sintering die-attach material (2017-02-28),
8. 9545017 - Structures for z-axis interconnection of multilayer electronic substrates (2017-01-10),
9. 9005330 - Electrically conductive compositions comprising non-eutectic solder alloys (2015-04-14),
10. 9003648 - Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias (2015-04-14),
11. 8840700 - Preparation of metallurgic network compositions and methods of use thereof (2014-09-23),
12. 8221518 - Conductive compositions containing blended alloy fillers (2012-07-17),
13. 6716036 - Method of attaching circuitry to a modular jack connector using electrically conductive paste (2004-04-06),
Company Overview
Ormet Circuits, Inc. is a technology company based in San Diego, California, specializing in advanced circuit solutions. The company focuses on the design and manufacturing of high-performance printed circuit boards (PCBs) and related electronic components, catering to various industries including telecommunications, aerospace, and medical devices. Ormet is committed to innovation in circuit technology, emphasizing reliability and efficiency in its products to meet the evolving needs of its clients in a competitive market.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 27 2026

13 Patents

#411 in San Diego, CA

#5,664 in California

#23,863 in US

#45,104 in the World

San Diego, CA (US)
San Diego, CA, United States of America

Ormet Circuits, Inc.

Forward Citations = 50

15 inventors:

goldMedal Catherine A Shearer (11 out of 11 patents)

silverMedal Michael C Matthews (6 out of 8 patents)

bronzeMedal Kenneth C Holcomb (4 out of 4 patents)

4.  G Delbert Friesen (3 out of 3 patents)

5.  Eunsook Barber (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ormet Circuits, Inc.. Retrieved from https://idiyas.com/company/ormet-circuits

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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