Eunsook Barber

Title: Eunsook Barber: Innovator in Semiconductor Technology

Introduction

Eunsook Barber is a notable inventor based in San Diego, CA. He has made significant contributions to the field of semiconductor technology, holding 2 patents that focus on advanced materials for semiconductor applications. His work is instrumental in enhancing the performance and reliability of semiconductor devices.

Latest Patents

Barber's latest patents include innovative compositions for semiconductor die attach applications. One of his patents describes sintering pastes with high metal loading, which contain over 60% metal volume after thermal reaction. This composition includes a mixture of metal particles, featuring both lead-free low melting point (LMP) and high melting point (HMP) particles. The formulation is designed to create a robust bond while maintaining performance under high temperatures.

Another significant patent focuses on semiconductor packaging that utilizes sintering die-attach materials. These materials provide a lead-free solution that offers superior electrical, thermal, and mechanical performance compared to previous alternatives. The technology allows for the application of sintering materials on either side of the wafer, ensuring a strong metallurgical bond throughout the die-attach joint.

Career Highlights

Eunsook Barber is currently employed at Ormet Circuits, Inc., where he continues to develop cutting-edge solutions for the semiconductor industry. His expertise in materials science and engineering has positioned him as a key player in advancing semiconductor packaging technologies.

Collaborations

Throughout his career, Barber has collaborated with talented professionals, including Catherine A. Shearer and Michael C. Matthews. These collaborations have fostered innovation and contributed to the successful development of new technologies in the semiconductor field.

Conclusion

Eunsook Barber's contributions to semiconductor technology through his patents and work at Ormet Circuits, Inc. highlight his role as an influential inventor. His innovative approaches to die attach materials and semiconductor packaging continue to shape the future of the industry.